Notice: Function _load_textdomain_just_in_time was called incorrectly. Translation loading for the relevanssi domain was triggered too early. This is usually an indicator for some code in the plugin or theme running too early. Translations should be loaded at the init action or later. Please see Debugging in WordPress for more information. (This message was added in version 6.7.0.) in /home/u713780661/domains/altimateqod.com/public_html/__svmi/wp-includes/functions.php on line 6121

Notice: Function _load_textdomain_just_in_time was called incorrectly. Translation loading for the acf domain was triggered too early. This is usually an indicator for some code in the plugin or theme running too early. Translations should be loaded at the init action or later. Please see Debugging in WordPress for more information. (This message was added in version 6.7.0.) in /home/u713780661/domains/altimateqod.com/public_html/__svmi/wp-includes/functions.php on line 6121

Notice: Function WP_Scripts::localize was called incorrectly. The $l10n parameter must be an array. To pass arbitrary data to scripts, use the wp_add_inline_script() function instead. Please see Debugging in WordPress for more information. (This message was added in version 5.7.0.) in /home/u713780661/domains/altimateqod.com/public_html/__svmi/wp-includes/functions.php on line 6121
Lithography - Silicon Valley Microelectronics
(408) 844-7100
Home / Lithography
Download Line Card

Standard test patterns are available for use in CMP, Etch, Clean, Packaging, and Biotech applications. In addition to our standard test patterns, SVM accepts custom patterning projects based on end-user design. 

  • Materials: silicon, glass
  • Diameters: 50mm to 300mm
  • Lithography Tools: immersion, scanner, stepper, proximity/contact aligner, e-beam
  • Technology Nodes: 65nm, 90nm, 130nm, 180nm, 250nm and larger
  • Photoresist: 193nm, 248nm(DUV), I-Line
  • Etch: Wet, RIE, DRIE, Lift off
  • CMP: W, Cu, Al, oxide, TEOS, SiN, etc.
  • Metrology: mask/reticle manufacture, SEM, cross section, e-test etc.

Test Reticles:

  • CMP dishing and erosion
  • Surface trench isolation (STI)
  • Damascene and dual damascene
  • Line/Space arrays
  • Redistribution later (RDL)
  • Via arrays
  • Bond Pads
  • Daisy chain
  • Memory patterns
  • E-testable structures
  • Wafer level packaging (WLP)
  • TSV – Through Silicon Via
  • Cu Pillars

Specialty Products:

  • Precious metals: Au, Pd, Ag, Pt
  • Thick photoresist
  • Polymides

­­­­­­­­­­­­­­­­­

Not finding what you’re looking for?

If you have a question or would like to request a quote, please contact a member of our Sales Team.

Contact UsInventory

Anywhere in the Bay Area within 4 hours.

In the United States within 1 day.

Internationally within 3 days.